Overview
The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly: the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.
The conference consists of formal invited presentation sessions and poster sessions for contributed papers. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 15th in the series.
Testimonials
“There were a total of 34 talks and 81 poster presentations that summarized major issues and provided critical reviews of crucial semiconductor developments and techniques needed as the industry evolves to silicon nanoelectronics and beyond.”
-Alex Braun, “A Jaunt Through Nanotechnopolis,” Semiconductor International.
“If you want to meet, greet, and learn from the world‘s experts in metrology, this is the place to be.”
-Dan Hutcheson, The Chip Insider.
Abstract Submission
Program Co-Chairs
- Alain Diebold, University of Albany
- Markus Kuhn, Rigaku
- Alexander Liddle, Canon Nanotechnologies, Inc.
- Paul van der Heide, imec
- Jin Zhang, Lam Research
Invited Speakers
- Bryan Barnes, NIST
- Maxime Besacier, Director Laboratoire des technologies de la Microélectronique
- Abhi Bharve, Vulcan Labs
- Umberto Celano, Associate Professor, Arizona State University
- Jim Chambers, Nvidia
- Robert Chau, Senior Vice President of Research, Natcast
- Meghali Chopra, Sandbox Semiconductor
- Alain Diebold, CNSE, University of Albany
- John Gaskins, Laser Thermal
- Julius Hållstedt, Head of Segment – Semi and Electronics, Excillum AB
- G. Dan Hutcheson, Vice Chair of TechInsights Inc.
- Andrew Humphris, CTO Infinitesima
- Gowri Kamarthy Lam Research
- Noriyuki Kawashima, Hitachi
- Alex Merkelov, Principal Scientist, IMEC
- Lars Mester, Attocube
- Mathieu Munsch, Co-founder and CEO of Qnami
- Patrick Naulleau, CEO EUV Tech
- Sarah Okada, Director of Product Marketing, Nova
- Stuart Parkin, Director at the Max Planck Institute of Microstructure Physics
- Cassandra Philips, Bruker
- Doug Resnick, Canon Nanotechnologies
- Koichiro Saga, Distinguished Engineer at Sony Corporation
- Daniel Schmidt, IBM
- Todd Stievater, NRL
- Robert Stroud, Tescan
- Aviram Tam, Applied Materials
- Takeo Watanabe, Hyogo University
- Philip Wong, Stanford University
- April Shuyan Zhang, TEL
- Jin Zhang, Senior Engineering Manager, Lam Research
- Ehrenfried Zscech, Professor MaLab
